Mission-Critical Manufacturing™
Production Capability

Since 1968, Calumet has provided a "Made in the USA" option to every company requiring a trusted partner to participate in the high-performance electronics marketplace. The following capability matrix is a snapshot of current, developing and planned manufacturing capabilities.

Capability Roadmap	2010	2011	2012
Product Type
Product Type	Rigid	Rigid	Rigid/Flex
Via Technology	Through Hole	Buried & Blind	Buried & Blind
Minimum Base Copper Thickness	1/2 ounce	1/4 ounce	1/8 ounce
Bow /Twist	1.00%	0.75%	0.50%
Product Complexity
Board Size Diagonal	29.5"	29.5"	29.5"
Total Board Thickness	.031" - .125"	.031" - .125"	.031" - .125"
Number Conductive Layers	2-16	18-24	24+
Diameter Drilled Holes	.010	.008	.006
Total PTH Tolerance	.003	.003	.002
Hole Location Tolerance	.004	.003	.003
Inner Layer Space Minimum	.004	.003	.003
Inner Layer Trace Width Minimum	.003	.003	.003
Internal Layer Process Allowance	.003	.003	.002
External Layer Space Minimum	.004	.003	.003
External Layer Trace Width Minimum	.003	.003	.003
External Layer Process Allowance	.003	.003	.002
Feature Location DTP	.004	.004	.003
Process Capability
Through Hole Aspect Ratio	8:1	12:1	15:1
Min. Component Pitch	.016	.012	.008
Max. Overall Board Thickness	.125	.125	.125
Minimum Soldermask Webbing	.004	.003	.0025
Impedance Tolerance	+/- 10%	+/- 8%	+/- 5%
Sequential Lamination	N/A	2 cycles	3+ cycles
Stacked/Staged Vias	N/A	prototype	production
Embedded Passives	N/A	prototype	production

Please contact us for further updates and/or specific interests.

Mission-Critical Manufacturing™Production Capability

Mission-Critical Manufacturing™
Production Capability