Making the difference in Printed Circuit Boards for over 40 years!
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Mission-Critical Manufacturing; There IS a Difference!™
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25830 Depot Street
Calumet, Michigan 49913
t. 906.337.1305
f. 906.337.5359
 
  Our Company
 
Process Descriptions Overview
Each process is precisely engineered for optimum results. Trained operators perform the processes using state-of-the-art equipment according to approved standard operating procedures.
 

>>  Production Tooling
>>  Drill/Rout
>>  Hole Preparation
>>  Primary Imaging
>>  Lamination

>>  Electroless Copper Plating
>>  Copper/Tin Electroplating
>>  Selective Surface Plating
>>  Nickel/Gold Tab Plating
>>  Solder Mask
 Production Tooling
  • CAD/CAM generated tooling from customer supplied part data
  • CAM laser plotting
  • Automatic film processing
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 Drill/Rout
  • CNC drilling/routing
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 Hole Preparation
  • Permanganate de-smear-multilayers
  • Plasma de-smear-multilayers
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 Primary Imaging
  • Automated dry film lamination, UV imaging with video registration, automated developing  
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 Lamination
  • High pressure, high temperature, vacuum assisted, with separate cooling press
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 Electroless Copper Plating
  • Through hole and via plating in automated plating lines
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 Copper/Tin Electroplating
  • Copper/Tin sulfate plating on automated plating lines  
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 Selective Surface Plating
  • Hot air tin/lead solder leveled on automated horizontal plating line
  • Hot air leveled Lead-Free solder on vertical line
  • Electroless nickel/immersion gold on automated plating line  
  • Immersion silver on automated plating line
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 Nickel/Gold Tab Plating
  • Electroplating on automated tab plating line
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 Solder Mask
  • Liquid photo-imageable solder mask (LPI) application on automated line  
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