Making the difference in Printed Circuit Boards for over 40 years!
   Our Company
     >>  Company Overview
     >>  Company Profile
     >>  Company Policies
     >>  Process Description
   Military
   Certifications
   Production Capabilities
   Quality System
   Media
   Contact
What is PCB University?
E-MAIL
PASSWORD
FORGOT YOUR PASSWORD?

Mission-Critical Manufacturing; There IS a Difference!

Click here to view our video!
 

25830 Depot Street
Calumet, Michigan 49913
t. 906.337.1305
f. 906.337.5359

 
  Our Company
 
Process Descriptions Overview
Each process is precisely engineered for optimum results. Trained operators perform the processes using state-of-the-art equipment according to approved standard operating procedures.
 

>>  Production Tooling
>> 
Drill/Rout
>> 
Hole Preparation
>> 
Primary Imaging
>> 
Lamination

>>  Electroless Copper Plating
>> 
Copper/Tin Electroplating
>> 
Selective Surface Plating
>> 
Nickel/Gold Tab Plating
>> 
Solder Mask

 Production Tooling
  • CAD/CAM generated tooling from customer supplied part data
  • CAM laser plotting
  • Automatic film processing
 [ back to top ]
 
 Drill/Rout
  • CNC drilling/routing
 [ back to top ]
 
 Hole Preparation
  • Permanganate de-smear-multilayers
  • Plasma de-smear-multilayers
 [ back to top ]
 
 Primary Imaging
  • Automated dry film lamination, UV imaging with video registration, automated developing  
 [ back to top ]
 
 Lamination
  • High pressure, high temperature, vacuum assisted, with separate cooling press
 [ back to top ]
 
 Electroless Copper Plating
  • Through hole and via plating in automated plating lines
 [ back to top ]
 
 Copper/Tin Electroplating
  • Copper/Tin sulfate plating on automated plating lines  
 [ back to top ]
 
 Selective Surface Plating
  • Hot air tin/lead solder leveled on automated horizontal plating line
  • Hot air leveled Lead-Free solder on vertical line
  • Electroless nickel/immersion gold on automated plating line  
  • Immersion silver on automated plating line
 [ back to top ]
 
 Nickel/Gold Tab Plating
  • Electroplating on automated tab plating line
 [ back to top ]
 
 Solder Mask
  • Liquid photo-imageable solder mask (LPI) application on automated line  
 [ back to top ]
 
 

Home - Military - Our Company - Certifications - Production Capabilities - Quality System - Media - Contact