mission-critical PCBs
Materials Declaration
Calumet Electronics Corporation

Mission-Critical Manufacturing™
Partnered Technology

There's a lot going on and into a printed circuit board. Calumet has been manufacturing printed circuit boards in the USA for over 40 years. Mission-Critical Manufacturing is our total quality management method engineered to produce high reliability circuit boards and high performance partnerships. Calumet partners with its customers to harness the creativity and innovation of both partners to create a synergy that brings the best value to the marketplace.

Information Technology

Calumet's internet-based electronic transactions use standard electronic data interface (EDI) templates that integrate supply-chain management systems to increase productivity throughout the organization. Integrated systems provide increased flexibility to balance supply with demand with inventory management programs that drive down the cost of inventory and reduce lead-times to as short as transit time.

Process Technology

Mission-Critical Manufacturing delivers the highest standards of quality and value. Advanced process capability and control delivers dock-to-stock quality as standard operating procedure. This standard becomes the benchmark for performance and the means to measure improvement.

Emerging Technology

New, more powerful generations of digital signal processing (DSP) chips with parallel-processing capabilities continue to meet escalating demand for the increased computing power and speed required in avionic Electrical Warfare (EW) and Signal Intelligence (SIGINT) applications. Electrical transmission inter-connect traces have already begun to limit overall capabilities and create multiple signal routing difficulties because of bandwidth limitations and high bandwidth design requirements. Calumet's electro/optical printed circuit boards feature polymer waveguide interconnections with inherently large transmission bandwidth capabilities can be utilized to alleviate this digital data transmission bottleneck and overcome bandwidth limitations of copper-based interconnects alone.
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